VSMC has opened its first 12-inch (300mm) wafer fab in Tampines, Singapore. The Facilty has completed construction and entered the risk production phase, with mass production scheduled to begin in the first quarter of 2027.
VSMC was established in September 2024 by Vanguard International Semiconductor (VIS) and NXP Semiconductors. The groundbreaking ceremony took place in December of the same year. After 22 months of construction, The Facilty has completed processing its first batch of sample wafers, achieving a yield rate of over 99%. The company stated that mass production plans are proceeding as scheduled.
The opening ceremony was attended by Singapore's Minister for Trade and Industry, Gan Kim Yong; Chairman of the Singapore Economic Development Board, Foo Chee Wen; and CEO of JTC Corporation, Fu Haiyan. Representatives from TSMC, as well as customers, suppliers, and industry organizations, also participated in the event.
The fab will support processes from 130nm to 40nm for applications such as mixed-signal, power management, analog chips, and interposers, targeting high-performance computing, mobile devices, automotive, industrial, and consumer markets.