On November 5, the 9th China International Import Expo (CIIE) opened in Shanghai. Intel participated in the Technology and Equipment Exhibition Zone under the theme "Boosting Intelligence Efficiency, Going Green Together," showcasing high-efficiency computing products and solutions alongside ecosystem partners. Through this window, one can glimpse the ecosystem landscape of Intel and its industry partners jointly promoting the deployment of computing power.
From the booth to beyond, Intel's ecosystem collaborations span multiple levels: Intel's Open Agent Rack Platform Specification, Integrated Green Power Storage and Compute Solution, Token All-in-One Machines, and AI Agent PCs were showcased at the CIIE booth; collaboration cases with AAC Technologies, Union Memory, CVTE, Pies Interconnect, Sunmi Technology, and Deepal Auto represent Intel's recent progress with partners.
In the era of AI agents, how can computing power translate into lasting productivity in real-world application scenarios? Judging from the practices of Intel and its partners, the answer lies in "open platforms" and "ecosystem synergy."
Ecosystem Synergy: Beyond Single-Point Performance
AI agent applications require handling large volumes of concurrent tasks and rapidly creating and running massive sandbox environments. In addition to CPU performance, the synergistic capabilities of compute, memory, power supply, cooling, and system scheduling are becoming increasingly important, requiring collaboration across the upstream and downstream of the industry chain.
Wang Zhicong, Chairman of Intel China, stated: "In the era of AI agents, advancements in computing power must be combined with industrial needs, energy efficiency, and commercial sustainability to translate into lasting productivity."
Data Centers: Integrating Differentiated Capabilities with Unified Standards
In compute centers designed for AI agents, Intel is collaborating with industry partners to integrate their respective expertise into a unified rack-level architecture, covering Everythinggj from standards and cooling to storage. At the CIIE booth, Intel showcased the Open Agent Rack Platform Specification developed jointly with industry partners. This specification incorporates compute, memory, power supply, and cooling into a collaborative rack-level design, supporting partners in developing differentiated products based on unified standards.
Beyond the booth, recent collaborative progress also reflects similar synergistic approaches. AAC Technologies has joined Intel China's Data Center Liquid Cooling Innovation Acceleration Program, combining its expertise in precision manufacturing, automation, structural components, and thermal management with Intel's requirements for high-density servers and rack-level architectures. This collaboration advances key component development, sample preparation, node integration, and system validation in phases. Union Memory, meanwhile, jointly released with Intel a practical implementation of KV Cache acceleration for AI agent inference: a layered KV Cache solution centered on Intel Xeon 6 processors, combined with Union Memory's UH812a enterprise SSDs, helping enterprise users achieve stable and reliable storage deployments.
Green Intelligent Computing: Cross-Boundary Collaboration Between IT and Energy to Connect Compute with Green Power
At the CIIE booth, Intel's Integrated Green Power Storage and Compute Solution represented a cross-industry collaborative practice. Centered on Intel architecture CPU compute platforms, it collaborated with leading Chinese energy storage and power companies, combining the capabilities of Chinese IT industry partners in equipment design and manufacturing, open-source AI ecosystems, and compute optimization. This resulted in standardized, modular containerized compute cabins, creating a new type of AI infrastructure that synergizes computing power with energy storage.
The value of collaboration is ultimately reflected in deployment flexibility: solutions can be deployed close to available green power resources or near compute demanders; the entire equipment can be customized in factories within approximately 8–12 weeks, and can be operational within a week after arrival on site, supporting phased construction and on-demand expansion for customers.
Smart Terminals and Enterprise Deployment: Bringing AI Agent Applications into Workflows
On the CIIE booth, ecosystem collaborations on both the client and enterprise sides were clearly visible. On the client side, leveraging CPU, GPU, and NPU compute engines along with hybrid deployment featuring edge-cloud synergy, Intel partnered with ecosystem partners to bring multiple AI agent applications and systems to PCs, integrating agents into workflows for office work, learning, creative design, entertainment, daily life, and PC settings. On the enterprise side, Intel joined forces with ecosystem partners to launch Token All-in-One Machines for localized enterprise AI deployment, lowering the barrier to AI adoption for businesses.
Industry Implementation: Partners Understand the Industry, Intel Provides the Platform
Transforming platform capabilities into industry solutions relies on partners' understanding of industry scenarios. Beyond what was displayed on the booth, Intel and its partners have recently implemented collaborative practices across several industries, including healthcare, electronics manufacturing, retail and dining, and automotive:
Healthcare: Based on the local AI computing power of the Intel Core Ultra platform, Intel's medical display optimization solutions, and S-TCI centralized management technology, CVTE created the MAXHUB healthcare solution. Medical-specific terminals combined with edge-side medical AI agents support AI medical assistants in intelligently generating medical records, improving the clarity of medical image reading, and enabling rapid software deployment and upgrades as well as local processing of sensitive data, providing valuable references for intelligent applications in the healthcare industry.
Electronics Manufacturing: Based on Intel Xeon processors, Intel Arc Pro B70 GPUs, and the Open Edge Platform, Pies Interconnect created the SailWind solution and launched an AI-native EDA All-in-One Machine for AI agents. This solution connects the data link from chip to PCBA R&D and manufacturing, helping enterprises accumulate reusable digital assets while protecting local data.
Retail and Dining: Leveraging Intel's hardware and software platforms and ecosystem compatibility across client, edge, and enterprise computing environments, Sunmi Technology has built a comprehensive smart commerce solution covering front-end commercial terminals and store edge computing nodes. This integrates AI capabilities into store operational processes, helping to improve store operational efficiency and consumer experience.
Automotive: Deepal Auto partnered with Intel to promote the implementation of the AI Box Ultra solution based on the Intel Core Ultra platform, bringing PC-level computing power and application ecosystems into the Deepal L06 vehicle cockpit. This supports local data processing, helps protect user privacy, and provides a localized intelligent experience for the cockpit.
The common thread among these industry cases is bringing AI closer to data and business operations: sensitive medical data, enterprise R&D and manufacturing data, and cockpit data are processed locally, while store-level AI capabilities are deployed to edge nodes. Intel provides an open and compatible hardware and software platform, while partners contribute their understanding and experience of industry scenarios, transforming "platform capabilities" into "industry solutions."
Outlook: Building Sustainable Industrial Partnerships Together
Over its 41 years of operation in China, Intel has remained deeply rooted in the Chinese market, growing alongside the local industry. Currently, leveraging an extensive local business network, Intel is building an open ecosystem together with more than 15,000 partners.
Wang Zhicong, Chairman of Intel China, also stated: "The CIIE is not only a window for showcasing new technologies and applications but also an important platform for connecting different market demands and deepening long-term cooperation. Intel will leverage its global products and open platform advantages to deepen collaboration with Chinese industry partners, promoting global technologies to better serve local applications, while ensuring that customized innovative products based on local needs benefit both the Chinese and global markets."
Intel believes that sustainable industrial partnerships are built on complementary strengths, mutual learning, and continuously solving practical problems. The value of an open platform lies not only in supporting specific applications but also in effectively connecting the specialized capabilities of different partners, gradually transforming project-based cooperation into shared technological and ecosystem capabilities for mutual development. Intel stated that it will continue to enhance application efficiency and deployment flexibility through pragmatic collaboration, practicing "Boosting Intelligence Efficiency, Going Green Together" in industrial cooperation.